 | Semiconductor Processing: develop simulations of several semiconductor
processing methods, including:
 | Cu Metallization:
Develop KLMC and facet codes to model film growth to
predict grain size and shape, grain orientation, roughness, and film quality (voids), as a function of deposition
conditions (deposition rate, temperature, substrate roughness, materials) - Motorola |
 | Oxidation of Si: Determine mechanisms of oxidation of Si, including
adsorption, initial diffusion, and initial oxide formation |
 | Ion implantation: MD simulations of cascade formation to determine defect
formation (LLNL) |
 | Thin Film Facet Growth Visualization:
Development of a two-dimensional visualization tool for the nucleation and evolution of
polycrystalline thin films. |
 | Ta (and other EAM) Potential Development: Develop an EAM potential for Ta from an ab
inito force database for use in molecular dynamics simulation of
thin film growth. |
|
 | General Interface and Surface Science |
 | Catalysis: determine how conventional and novel catalytic
converters act to convert automotive exhaust into harmless emissions using
both quantum chemistry and a rate
equation analysis (Ford) |
 | Adhesion at Metal-Ceramic Interfaces: investigate possible coatings for
tools used for aluminum processing, to determine which coatings will minimize adhesive wear (ALCOA), including interfacial adhesion and adhesive
wear. |
 | Nanotribology: understand
the nanomechanism of tribology on atomic scale by using molecular dynamics
simulations, and to help interpret experimental studies on nanoindentation
and wear. |
 | Chemical-Mechanical Polishing (CMP): Investigate the fundamental mechanisms of
simultaneous chemical etching and mechanical abrasion that occur during CMP
(Motorola, Speedfam-IPEC, Rodel). |
 | Develop new computer modelling methods, including improved electronic
structure methods and more robust interatomic potentials
|